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激光晶圆切割机

laser wafer cutting machine
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智能装备
1
产品描述

1-14 精圆切割机详情

 

激光晶圆切割机

激光隐形切割是将特定波长的激光通过光学系统聚焦在材料内部,该光学系统具有极好的聚焦性能,能够把光压缩到衍射极限,具有较高的峰值功率密度,在材料中间形成改质层,通过扩展胶膜等方法将工件分割,而不会破坏工件表面和边缘,激光隐形切割作为激光切割晶圆的一种方案,很好的避免了砂轮划片存在的问题。
在外观方面通过对视觉品牌形象元素和起伏山峦线条的提取在设计思路上将安全,力量感作为外观设计基调,同时用红蓝黑三色配色表现出产品的科技感和特有的行业情感。边缘的圆角处理使产品在保持主基调不变的同时更生动、更高级。

 

Laser stealth cutting is to focus the laser with a specific wavelength inside the material through the optical system. The optical system has excellent focusing performance, can compress the light to the diffraction limit, has a high peak power density, forms a modified layer in the middle of the material, and divides the workpiece by expanding the adhesive film without damaging the surface and edge of the workpiece. Laser stealth cutting is a scheme for laser wafer cutting, It can avoid the problem of grinding wheel slicing.

In terms of appearance, safety and strength are taken as the keynote of appearance design through the extraction of visual brand image elements and undulating mountain lines. At the same time, red, blue and black colors are used to show the sense of technology and unique industry emotion of the product. The fillet treatment of the edge makes the product more vivid and advanced while keeping the main tone unchanged.

 

2-14 精圆切割机详情.

 

3-14 精圆切割机详情.

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