Laser stealth cutting is to focus the laser with a specific wavelength inside the material through the optical system. The optical system has excellent focusing performance, can compress the light to the diffraction limit, has a high peak power density, forms a modified layer in the middle of the material, and divides the workpiece by expanding the adhesive film without damaging the surface and edge of the workpiece. Laser stealth cutting is a scheme for laser wafer cutting, It can avoid the problem of grinding wheel slicing.
In terms of appearance, safety and strength are taken as the keynote of appearance design through the extraction of visual brand image elements and undulating mountain lines. At the same time, red, blue and black colors are used to show the sense of technology and unique industry emotion of the product. The fillet treatment of the edge makes the product more vivid and advanced while keeping the main tone unchanged.
HangYu Il area wuhan university science park wuhan.